RAAAM Memory Technologies, an Israeli semiconductor startup developing next-generation on-chip memory, announced Tuesday it has raised $17.5 million in an oversubscribed Series A funding round led by NXP Semiconductors.
The round also included participation from a leading multinational networking corporation, IAG Capital Partners, the European Innovation Council (EIC) Fund, LiFTT, Alumni Ventures, and all existing investors, including J-Ventures, Silicon Catalyst Ventures, and Serpentine Ventures. The new capital brings RAAAM’s total funding to over $24 million, including equity investments and a grant from the prestigious EIC Accelerator program.
The funds will support full qualification of RAAAM’s patented GCRAM (granular capacitor RAM) technology on advanced process nodes across several top-tier foundries. The company has already demonstrated its memory technology on silicon and recently announced a strategic collaboration with NXP.
“This oversubscribed funding round with high-profile strategic and financial investors is another sign of confidence in our company and our revolutionary technology,” said Robert Giterman, RAAAM’s CEO and co-founder. “Our solution promises to resolve the memory bottleneck in leading-edge AI chips through significant memory density improvement and lower power consumption compared to SRAM.”
Chief Business Officer Eli Leizerovitz said the backing from investors like NXP and a leading global networking firm validates the market need. “We’re now in a position to accelerate engagements with leading semiconductor companies and foundries, and align closely with our customers’ product roadmaps,” he said.
Victor Wang, vice president of Front-End Innovation at NXP Semiconductors, praised the company’s progress. “We’ve collaborated with RAAAM for several years and have seen first-hand the potential of their on-chip memory technology,” he said. “Their solution directly addresses one of the most critical challenges in advanced chip design, and we believe it can deliver significant density and power gains across multiple applications.”
Svetoslava Georgieva, chair of the EIC Fund Board, emphasized the strategic importance of the technology for Europe. “RAAAM’s breakthrough in on-chip memory directly addresses a critical challenge in the semiconductor value chain. We are happy to support their path from proven prototypes to market-ready solutions.”
Founded in 2021, RAAAM Memory Technologies is headquartered in Israel with an R&D center in Switzerland. Its GCRAM product offers up to 50 percent area reduction and up to 10x lower power consumption than high-density SRAM and is compatible with standard CMOS processes, enabling seamless adoption by chipmakers.